Major Design Experience and Technologies from Here
Device Model Extraction
By applying our simulators to the extraction of model parameters for semiconductor devices (transistors, resistors, etc.), we can contribute to high-precision circuit validation.
Distinctive points
- A rich track record, extending over more than 15 years
- Provision of high-precision device models
- Consistent support:TEG concept and design->Modeling->Product design environment (PDK*)
- *
- Product design kit
IBIS (I/O Buffer Information Specification) Model Creation
We provide an industry-standard model for the simulation of transmission lines.
Features
- Proven track record on more than 1000 products
- High-quality IBIS models
- IBIS models for inter-module interfaces
- Expediting compliance with the recommendations on IBIS quality from the EIA-IBIS Committee
EDA Environments
- The environments we provide can fully satisfy any requirements for customization.
- Our total design environments cover everything from circuit and layout design to validation.
CIM System-VCIM
VCIM : most Valuable Computer Integrated Manufacturing
Our many years of practical experience are the basis for providing extensible systems.
- Application of an industry-standard open system
- Supports the Sematech CIM framework
- Supports next-generation technology for control of wafers and other sheet materials
This distributed system architecture has superior expandability and resistance to defects, and is in service at more than 100 sites of more than 45 companies, both domestic and overseas.
The name of this company and product and company names on the remaindor of the page are trademarks of the respective companies.
FIB (Focused Ion Beam) Processing Services
Features
- Quick delivery (minimum time is only one day)
- Supporting various sample geometries
- Supporting all kinds of layout information
- Supporting all kinds of processes, even with new materials
- Applicable within clean rooms
- Capable of large-volume processing
Changes to logic
By opening or connecting wiring in the region of interest, this processing is capable of making changes to logic.
Connections to high aspect-ratio holes
This processing is capable of connections with holes having aspect ratios up to about 10 at their openings.
Analysis and Evalutions Solutions
Analysis of bad placement specifications
- Well-level photoemission analysis
- Chip back-face photoemission analysis
- Estimated wiring characteristics analysis (by EBAC*1)
Evaluation of device reliability
- Hot carriers, EM characteristics, TDDB*2, etc.
- Extreme-low-current analysis (fA order)
- Device temperature characteristics
- *1
- Electron beam absorption current
- *2
- Time-dependent dielectric breakdown
ROM Programming Services
Electronic request system and quick delivery
Production Support Services
- Support covers everything from post-design mask production, through arrangements for trial production, testing and evaluation (of reliability), and defect analysis, to the creation of the documents for use in mass-production
- TEG layout design, placement, and mask handling services
Applying TEG in Various Kinds of Evaluation and Consulting
We provide TEG for use in evaluation during the development of processes, fabrication devices, and materials.
- A consistent approach covers all stages from the design of masks and processes to TEG evaluation.
- Systematic and qualitative evaluation and consultation on the margins of characteristics and processes.
